About:
Semiconductor backend processes Lab, particularly in Product and Quality Engineering.
Education:
90.04 ~ 92.03 TOHOKU University Department of Electrical Communication Engineering Master
89.01 ~ 89.12 TOHOKU University Department of Electrical Engineering B.S.
Experience:
24.01 ~ Gachon University Department of Semiconductor Display Professor
22.01 ~ 23.12 SK HYNIX Semiconductor Semiconductor University Professor
92.07 ~ 21.12 SK HYNIX Semiconductor semiconductor Product & Quality Engineering Leader
& Executive
Honors & Specialities:
2022.06 Semiconductor Device Test and Fabrication Method of Micro Bump Thereof (The Institute of Semiconductor Test)
2023.06 Quality and Reliability of Memory Semiconductors in the AI Era(Keynote Speech, The Institute of Electronics Engineers)
2006.04 Semiconductor device and fabrication method thereof (2)(US Patent 11396525 (2006.04.04.))
2004.06 Semiconductor device and fabrication method thereof (1)(US Patent 10868216 (2004.06.16))
2000.04 반도체 소자 및 그 제조방법 1002533720000 (2000.01.22)
